JPS6254880B2 - - Google Patents
Info
- Publication number
- JPS6254880B2 JPS6254880B2 JP54146183A JP14618379A JPS6254880B2 JP S6254880 B2 JPS6254880 B2 JP S6254880B2 JP 54146183 A JP54146183 A JP 54146183A JP 14618379 A JP14618379 A JP 14618379A JP S6254880 B2 JPS6254880 B2 JP S6254880B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- conductive
- members
- engaging portion
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14618379A JPS5669398A (en) | 1979-11-12 | 1979-11-12 | Holding apparatus of electroplating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14618379A JPS5669398A (en) | 1979-11-12 | 1979-11-12 | Holding apparatus of electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5669398A JPS5669398A (en) | 1981-06-10 |
JPS6254880B2 true JPS6254880B2 (en]) | 1987-11-17 |
Family
ID=15402006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14618379A Granted JPS5669398A (en) | 1979-11-12 | 1979-11-12 | Holding apparatus of electroplating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5669398A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103510144A (zh) * | 2013-09-17 | 2014-01-15 | 兰继红 | 一种金属件电镀悬挂架 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1172462A1 (en) * | 2000-07-12 | 2002-01-16 | BAE SYSTEMS plc | A jig and a method and apparatus of applying a surface treatment to a member on the jig |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4214766Y1 (en]) * | 1964-07-11 | 1967-08-23 | ||
JPS5535340Y2 (en]) * | 1974-05-27 | 1980-08-20 | ||
JPS5437772Y2 (en]) * | 1975-06-24 | 1979-11-12 |
-
1979
- 1979-11-12 JP JP14618379A patent/JPS5669398A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103510144A (zh) * | 2013-09-17 | 2014-01-15 | 兰继红 | 一种金属件电镀悬挂架 |
Also Published As
Publication number | Publication date |
---|---|
JPS5669398A (en) | 1981-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4752371A (en) | Elongated frame for releasably-holding printed circuit boards | |
US5788829A (en) | Method and apparatus for controlling plating thickness of a workpiece | |
US6887113B1 (en) | Contact element for use in electroplating | |
US4595480A (en) | System for electroplating molded semiconductor devices | |
JPS6254880B2 (en]) | ||
KR20200030651A (ko) | 인쇄회로기판용 개별 전기 도금장치 | |
US2911347A (en) | Plating rack | |
JPS635476B2 (en]) | ||
US4964964A (en) | Electroplating apparatus | |
US4511448A (en) | Plating apparatus | |
JP3062911B2 (ja) | メッキ装置 | |
US2338795A (en) | Wire plating apparatus | |
JP4216734B2 (ja) | 電気分解用移動・絶縁装置および電解設備 | |
US20070144896A1 (en) | Plating process enhanced by squeegee roller apparatus | |
CN214236652U (zh) | 一种沾锡装置 | |
US2129868A (en) | Article supporting rack for plating | |
US2316609A (en) | Article supporting rack | |
TWM574156U (zh) | 用於電鍍機的框形托架 | |
JPS625651A (ja) | 微細構造の被めっき部分のめっき方法およびそのための支持装置 | |
JPH0774477B2 (ja) | プリント配線基板の電解めっき用治具及び同治具を用いた電解めっき方法 | |
JPH0280599A (ja) | Icリードフレームのメッキ用引っ掛け治具 | |
JP7164403B2 (ja) | ワーク保持枠体及びそれを用いためっき処理装置 | |
KR100905310B1 (ko) | 기판 패널 | |
KR20010069219A (ko) | 와이어스프링그립, 리드프레임 캐리어벨트 및 도금시스템 | |
CN113088940B (zh) | 悬挂装置以及具有该悬挂装置的化学镀装置 |